Tag: 500-600

SDS of cas: 38103-06-9In 2019, Jiao, Yang;Chen, Guofei;Zhou, Haijun;Zhang, Feng;Chen, Xiaoqi;Li, Yantao;Xiao, Xueshan;Fang, Xingzhong published 《Synthesis and properties of processable poly(benzimidazole-imide)s based on 2-(3-aminophenyl)-5-aminobenzimidazole》. 《Journal of Polymer Research》published the findings. The article contains the following contents:

A series of poly(benzimidazole-imide)s (PBIPIs) derived from different dianhydrides and 2-(3-aminophenyl)-5-aminobenzimidazole (m-BIA) were synthesized via thermal imidization to form flexible films. This series of PBIPIs showed great T_gs ranging from 296 to 484°, excellent thermal stability performed in 5% weight loss temperatures (T_d5%s) of 502-529° in N₂ and good mech. properties (tensile strengths of 89-127 MPa, tensile moduli of 2.9-4.1 GPa and elongations at break of 3.9-6.9%). Compared with PIs derived from 6-amino-2-(4-(4-aminophenoxy)phenyl)-1H-benzimidazole (p-BIODA), m-BIA based PBIPI films exhibited higher T_g, and better solubility Besides, the thermoplastic PBIPI resin (PI-6-PA) derived from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and m-BIA exhibited good melt processability with high T_g of 273°, melt flow index (MFI) of 7.76 g/10 min, min. complex viscosity of 11.9 × 10³ Pa·s at 402° and low melt viscosity ratio of 2.46 at 400°. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.SDS of cas: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Zahra, Manzar;Zulfiqar, Sonia;Skene, William G.;Sarwar, Muhammad Ilyas published 《Crosslinking of polyamides using dianhydrides, diacid chloride and dialdehyde: a promising approach for water treatment》 in 2020. The article was appeared in 《Polymer International》. They have made some progress in their research.Name: 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) The article mentions the following:

New crosslinked polyamides were successfully produced from the condensation of pre-synthesized monomer, 5-(2,2,2-trifluoroacetamido)isophthaloylchloride (TFAIAC) and diamines at low temperature These polyamides were used as promising metal-chelating adsorbents due to the presence of O and N donor sites on the crosslinked polyamides. For this purpose, trifluoroacetic anhydride was used to protect the amino group of 5-aminoisophthalic acid, thus generating 5-(2,2,2-trifluoroacetamido)isophthalic acid (TFAIA). TFAIA was converted into TFAIAC using oxalyl chloride, which was exploited as a suitable monomer for the synthesis of aromatic polyamides. Amino groups were then set free under basic conditions and the crosslinking was carried out through amino groups present on the polyamide chains with different dianhydrides, isophthaloyl chloride and 2,5-thiophenedicarboxaldehyde. The synthesis of monomers and polymers was confirmed by FTIR, ¹H and ¹³C NMR spectroscopy and molar masses were measured by gel permeation chromatog. The crosslinked macromols. were found to possess enough chain alignment as depicted by their XRD patterns. The thermal stability of the crosslinked polyamides was increased as their decomposition temperatures were improved from 420 to 619 °C. Metal ion uptake was scrutinized through at. absorption spectroscopy with 83%-85% adsorption capacity at optimized parameters. The mechanism of adsorption was further investigated through the Freundlich and Langmuir adsorption isotherms. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Name: 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Tharakan, Simi Annie;Muthusamy, Sarojadevi published 《The effects of long and bulky aromatic pendent groups with flexible linkages on the thermal, mechanical and electrical properties of the polyimides and their nanocomposites with functionalized silica》. The research results were published in《RSC Advances》 in 2021.Reference of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) The article conveys some information:

A novel diamine bis(4-aminophenyl)bis{3,4[4-(8-quinolyloxymethyl carbonyl)]}methane, containing two long/bulky aromatic pendent chains was synthesized by incorporating aromatic and hetero aromatic groups with flexible linkages. Flexible, stretchable, thermally stable and processable polyimides were prepared by reacting this newly synthesized diamine with com. tetracarboxylic acid dianhydrides like 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA) and 4,4′-(4,4′-isopropylidenediphenoxy)diphthalic anhydride (BPADA). Nanocomposites of polyimides were prepared using aromatic amine functionalized silica as a filler by solution casting method. The current work investigates the effects of incorporating long/bulky aromatic side chains and flexible linkages on the thermal, mech., elec. and optical properties of the polyimides and nanocomposites. The polyimides showed good thermal stability (T_10% = 364 & 388), high flame resistance, low glass transition temperatures (T_g = 130°C & 156°C), very low dielec. constants (2.5 & 2.8 at 1 MHz) and good optical transparency. The neat polyimides displayed good elongation at break but possessed low tensile strength. The chem. imidized polyimides showed good solubility in low and high boiling solvents. Nanocomposites of polyimides based on aromatic amine functionalized silica exhibited enhanced properties with T_10% values varying between 409-482°C, T_g between 165-280°C and higher dielec. constants (3-5.7 at 1 MHz). And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Reference of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Wang, David H.;Tan, Loon-Seng published 《Origami-Inspired Fabrication: Self-Folding or Self-Unfolding of Cross-Linked-Polyimide Objects in Extremely Hot Ambience》 in 2019. The article was appeared in 《ACS Macro Letters》. They have made some progress in their research.Recommanded Product: 38103-06-9 The article mentions the following:

A methodol. that integrates a folding step into the conventional poly(amic acid)/polyimide film fabrication scheme is developed. It enables fabricating crosslinked polyimide (XCP2) films into a host of complex-shaped objects. Particularly unprecedented is that these origami (3D) objects can be unfolded into a 2D temporary shape under externally applied stress at T ∼ T_g and remain in the free-standing, 2D configuration at room temperature until spontaneously returning to the original 3D configuration at T > 200 °C. This 3D/2D/3D cycle can be repeated >20× without showing any sign of fatigue, as exemplified by a cubic box that shows visually no dimensional change after each cycle, and even after having been immersed in a 215 °C oil bath for 3 days. The enabling materials are two series XCP2s that are crosslinked by either a phosphine oxide-containing triamine (POTAm) or a trianhydride (POTAn). These crosslinked polyimides form tough and creasable films that possess ∼100% shape memory recovery and 99% shape memory fixity and withstand over 100 fatigue-prone, strain-stress-temperature cycles, while the linear version LCP2 film exhibits much lower shape memory recovery and fails after only 7 cycles. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Qiu, Guorong;Ma, Wenshi;Wu, Li published 《Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP》 in 2020. The article was appeared in 《Polymer-Plastics Technology and Materials》. They have made some progress in their research.Category: benzofurans The article mentions the following:

The thermoplastic and low dielec. constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4′-(4,4′-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4′-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric anal., dynamic thermomech. anal., dielec. measurement, and tensile test. The dielec. constants were 2.32-2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral Me groups, made polyimides become thermoplastic. The results of mol. simulations via Materials Studio also proved this conclusion. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Smotrina, T. V.;Alentyev, A. Yu.;Stoyanov, O. V.;Krasnopeeva, E. L. published 《The Interaction between Water and Hydroxyl-Containing Polyimide》 in 2022. The article was appeared in 《Polymer Science, Series D: Glues and Sealing Materials》. They have made some progress in their research.Product Details of 38103-06-9 The article mentions the following:

The specific interaction between aromatic polyimide with a hydroxyl group in a diamine fragment and water is studied by means of sorption and NMR relaxation spectroscopy. The influence of the mol. mobility of water and polymer on spin-spin and spin-lattice relaxation processes in the polyimide-H₂O and polyimide-D₂O systems is considered.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Product Details of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Application of 38103-06-9《Synthesis and properties of cardo-type polyimides containing hydroxyl groups for application in specific detection of fluoride ion》 was published in 2020. The authors were Wu, Yancheng;Liu, Shumei;Chen, Zhigeng;Zhao, Jianqing, and the article was included in《Dyes and Pigments》. The author mentioned the following in the article:

Here, four cardo-type polyimides containing hydroxyl groups have been successfully synthesized by one-step solution polymerization of a hydroxyl-containing fluorene diamine monomer and various com. dianhydride monomers. The obtained PIs with high mol. weights were readily soluble in many polar solvents. Simultaneously, they still maintain the excellent thermal stability (the 5% and 10% weight loss temperatures over 480° and 510° in nitrogen, resp.) and the high glass transition temperatures (T_gs, 342-442°). Furthermore, PI films show high tensile strength (>78 MPa) and relatively high optical transparency (over 82% at 500 nm), except PI-4. Utilizing that hydroxyl group in PI chain is able to form H-bond interaction with F^–, these hydroxyl-containing PIs in DMSO solution are successfully applied as colorimetric chemosensors for detection of F^– with high selectivity and sensitivity. Finally, the PI film chemosensors is also used for visual and reversible sensing of F^–, which enables them to be a fast and portable test kit for visible detection of F^–. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kong, Deyan;Li, Jie;Guo, Anru;Yu, Jianxin;Xiao, Xinli published 《Smart polyimide with recovery stress at the level of high temperature shape memory alloys》. The research results were published in《Smart Materials and Structures》 in 2021.Category: benzofurans The article conveys some information:

Recovery stress is important for smart shape memory materials (SMMs) and low recovery stress of shape memory polymers hinders their applications badly, while high temperature shape memory alloys (HTSMAs) are very difficult to be obtained. In order to obtain high temperature SMM with high recovery stress, convenient preparation methods, low cost and good workability, shape memory polyimide with high recovery stress (HRSMPI) at the level of HTSMA is prepared by reinforcing smart polyimide matrix with carbon fiber cloth (CFC) in common lab furnace. The HRSMPI possesses unique sandwich structure with good interfacial bonding between the matrix and filler. It exhibits high glass transition temperature of 300 °C, shape fixity of 90.6% and shape recovery of 92.2%. The recovery stress of HRSMPI is 116 MPa, close to those of some HTSMAs. The primitive actuator made of HRSMPI can overturn metal sheet 147 times heavier than itself, similar to the com. TiNiHf HTSMA. Meanwhile, its d. is 0.96 g cm^-3, less than 1/6 of that of TiNiHf. The elastic strain energy is mainly stored in CFC and then released as recovery stress under constrained shape recovery, and HRSMPI has great potential in practical applications. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Formula: C31H20O8In 2019, Huang, Xinzuo;Zhang, Fenghua;Liu, Yanju;Leng, Jinsong published 《Flexible and colorless shape memory polyimide films with high visible light transmittance and high transition temperature》. 《Smart Materials and Structures》published the findings. The article contains the following contents:

Colorless shape memory polyimide (CSMPI) has potential applications in broad fields, especially in advanced optoelectronics due to the excellent optical transparency, shape memory effect and high temperature resistance. In this work, high flexible dianhydrides and fluorine-containing diamines were used to synthesize CSMPI, which simultaneously combined great shape memory performance with high optical transparency. The effects of monomer ratios and imidization temperatures on the mol. structure and properties were investigated. Moreover, the CSMPI film possesses a higher glass transition temperature (Tg) of 234 °C, compared with the reported transparent shape memory polymers. Most importantly, the transmittance of CSMPI film is 87%-90% at 450-800 nm, meeting the requirements of heat resistance and transmittance of the substrate. Both shape recovery and shape fixity are over 97%. Flexible and colorless CSMPI films severed as substrates provide more potential in optoelectronic devices such as OLED and OPV, etc. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)In 2022, Zhao, Wanjing;Cao, Xianwu;Huang, Jinshu;Wen, Jiangwei;He, Yun;Zha, Junwei;Li, Robert Kwok Yiu;Wu, Wei published 《Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties》. 《eXPRESS Polymer Letters》published the findings. The article contains the following contents:

There is a great demand for low dielec. materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielec. permittivity of polymers while maintaining excellent thermal stability and mech. properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielec. permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielec. permittivity (2.47) and dielec. loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the mol. polarizability but also increased the free fractional volume In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI mol. chains, resulting in the inhibition of the mol. mobility. The incorporation of TAPB also enhanced the thermal stability and UV light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielec. permittivity for the electronic industry. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem