Learn more about cas: 38103-06-9 | Smart Materials and Structures 2019

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Formula: C31H20O8In 2019, Huang, Xinzuo;Zhang, Fenghua;Liu, Yanju;Leng, Jinsong published 《Flexible and colorless shape memory polyimide films with high visible light transmittance and high transition temperature》. 《Smart Materials and Structures》published the findings. The article contains the following contents:

Colorless shape memory polyimide (CSMPI) has potential applications in broad fields, especially in advanced optoelectronics due to the excellent optical transparency, shape memory effect and high temperature resistance. In this work, high flexible dianhydrides and fluorine-containing diamines were used to synthesize CSMPI, which simultaneously combined great shape memory performance with high optical transparency. The effects of monomer ratios and imidization temperatures on the mol. structure and properties were investigated. Moreover, the CSMPI film possesses a higher glass transition temperature (Tg) of 234 °C, compared with the reported transparent shape memory polymers. Most importantly, the transmittance of CSMPI film is 87%-90% at 450-800 nm, meeting the requirements of heat resistance and transmittance of the substrate. Both shape recovery and shape fixity are over 97%. Flexible and colorless CSMPI films severed as substrates provide more potential in optoelectronic devices such as OLED and OPV, etc. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem