Qiu, Guorong;Ma, Wenshi;Wu, Li published 《Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP》 in 2020. The article was appeared in 《Polymer-Plastics Technology and Materials》. They have made some progress in their research.Category: benzofurans The article mentions the following:
The thermoplastic and low dielec. constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4′-(4,4′-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4′-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric anal., dynamic thermomech. anal., dielec. measurement, and tensile test. The dielec. constants were 2.32-2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral Me groups, made polyimides become thermoplastic. The results of mol. simulations via Materials Studio also proved this conclusion. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .
5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem