eXPRESS Polymer Letters | Cas: 38103-06-9 was involved in experiment

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)In 2022, Zhao, Wanjing;Cao, Xianwu;Huang, Jinshu;Wen, Jiangwei;He, Yun;Zha, Junwei;Li, Robert Kwok Yiu;Wu, Wei published 《Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties》. 《eXPRESS Polymer Letters》published the findings. The article contains the following contents:

There is a great demand for low dielec. materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielec. permittivity of polymers while maintaining excellent thermal stability and mech. properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielec. permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielec. permittivity (2.47) and dielec. loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the mol. polarizability but also increased the free fractional volume In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI mol. chains, resulting in the inhibition of the mol. mobility. The incorporation of TAPB also enhanced the thermal stability and UV light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielec. permittivity for the electronic industry. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem