Jiao, Yang et al. published new experimental results with the assistance of cas: 38103-06-9

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.SDS of cas: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

SDS of cas: 38103-06-9In 2019, Jiao, Yang;Chen, Guofei;Zhou, Haijun;Zhang, Feng;Chen, Xiaoqi;Li, Yantao;Xiao, Xueshan;Fang, Xingzhong published 《Synthesis and properties of processable poly(benzimidazole-imide)s based on 2-(3-aminophenyl)-5-aminobenzimidazole》. 《Journal of Polymer Research》published the findings. The article contains the following contents:

A series of poly(benzimidazole-imide)s (PBIPIs) derived from different dianhydrides and 2-(3-aminophenyl)-5-aminobenzimidazole (m-BIA) were synthesized via thermal imidization to form flexible films. This series of PBIPIs showed great Tgs ranging from 296 to 484°, excellent thermal stability performed in 5% weight loss temperatures (Td5%s) of 502-529° in N2 and good mech. properties (tensile strengths of 89-127 MPa, tensile moduli of 2.9-4.1 GPa and elongations at break of 3.9-6.9%). Compared with PIs derived from 6-amino-2-(4-(4-aminophenoxy)phenyl)-1H-benzimidazole (p-BIODA), m-BIA based PBIPI films exhibited higher Tg, and better solubility Besides, the thermoplastic PBIPI resin (PI-6-PA) derived from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and m-BIA exhibited good melt processability with high Tg of 273°, melt flow index (MFI) of 7.76 g/10 min, min. complex viscosity of 11.9 × 103 Pa·s at 402° and low melt viscosity ratio of 2.46 at 400°. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.SDS of cas: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem