Month: September 2022

Kong, Deyan;Li, Jie;Guo, Anru;Yu, Jianxin;Xiao, Xinli published 《Smart polyimide with recovery stress at the level of high temperature shape memory alloys》. The research results were published in《Smart Materials and Structures》 in 2021.Category: benzofurans The article conveys some information:

Recovery stress is important for smart shape memory materials (SMMs) and low recovery stress of shape memory polymers hinders their applications badly, while high temperature shape memory alloys (HTSMAs) are very difficult to be obtained. In order to obtain high temperature SMM with high recovery stress, convenient preparation methods, low cost and good workability, shape memory polyimide with high recovery stress (HRSMPI) at the level of HTSMA is prepared by reinforcing smart polyimide matrix with carbon fiber cloth (CFC) in common lab furnace. The HRSMPI possesses unique sandwich structure with good interfacial bonding between the matrix and filler. It exhibits high glass transition temperature of 300 °C, shape fixity of 90.6% and shape recovery of 92.2%. The recovery stress of HRSMPI is 116 MPa, close to those of some HTSMAs. The primitive actuator made of HRSMPI can overturn metal sheet 147 times heavier than itself, similar to the com. TiNiHf HTSMA. Meanwhile, its d. is 0.96 g cm^-3, less than 1/6 of that of TiNiHf. The elastic strain energy is mainly stored in CFC and then released as recovery stress under constrained shape recovery, and HRSMPI has great potential in practical applications. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Application of 38103-06-9《Synthesis and properties of cardo-type polyimides containing hydroxyl groups for application in specific detection of fluoride ion》 was published in 2020. The authors were Wu, Yancheng;Liu, Shumei;Chen, Zhigeng;Zhao, Jianqing, and the article was included in《Dyes and Pigments》. The author mentioned the following in the article:

Here, four cardo-type polyimides containing hydroxyl groups have been successfully synthesized by one-step solution polymerization of a hydroxyl-containing fluorene diamine monomer and various com. dianhydride monomers. The obtained PIs with high mol. weights were readily soluble in many polar solvents. Simultaneously, they still maintain the excellent thermal stability (the 5% and 10% weight loss temperatures over 480° and 510° in nitrogen, resp.) and the high glass transition temperatures (T_gs, 342-442°). Furthermore, PI films show high tensile strength (>78 MPa) and relatively high optical transparency (over 82% at 500 nm), except PI-4. Utilizing that hydroxyl group in PI chain is able to form H-bond interaction with F^–, these hydroxyl-containing PIs in DMSO solution are successfully applied as colorimetric chemosensors for detection of F^– with high selectivity and sensitivity. Finally, the PI film chemosensors is also used for visual and reversible sensing of F^–, which enables them to be a fast and portable test kit for visible detection of F^–. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Smotrina, T. V.;Alentyev, A. Yu.;Stoyanov, O. V.;Krasnopeeva, E. L. published 《The Interaction between Water and Hydroxyl-Containing Polyimide》 in 2022. The article was appeared in 《Polymer Science, Series D: Glues and Sealing Materials》. They have made some progress in their research.Product Details of 38103-06-9 The article mentions the following:

The specific interaction between aromatic polyimide with a hydroxyl group in a diamine fragment and water is studied by means of sorption and NMR relaxation spectroscopy. The influence of the mol. mobility of water and polymer on spin-spin and spin-lattice relaxation processes in the polyimide-H₂O and polyimide-D₂O systems is considered.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Product Details of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Qiu, Guorong;Ma, Wenshi;Wu, Li published 《Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP》 in 2020. The article was appeared in 《Polymer-Plastics Technology and Materials》. They have made some progress in their research.Category: benzofurans The article mentions the following:

The thermoplastic and low dielec. constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4′-(4,4′-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4′-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric anal., dynamic thermomech. anal., dielec. measurement, and tensile test. The dielec. constants were 2.32-2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral Me groups, made polyimides become thermoplastic. The results of mol. simulations via Materials Studio also proved this conclusion. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Tharakan, Simi Annie;Muthusamy, Sarojadevi published 《The effects of long and bulky aromatic pendent groups with flexible linkages on the thermal, mechanical and electrical properties of the polyimides and their nanocomposites with functionalized silica》. The research results were published in《RSC Advances》 in 2021.Reference of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) The article conveys some information:

A novel diamine bis(4-aminophenyl)bis{3,4[4-(8-quinolyloxymethyl carbonyl)]}methane, containing two long/bulky aromatic pendent chains was synthesized by incorporating aromatic and hetero aromatic groups with flexible linkages. Flexible, stretchable, thermally stable and processable polyimides were prepared by reacting this newly synthesized diamine with com. tetracarboxylic acid dianhydrides like 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA) and 4,4′-(4,4′-isopropylidenediphenoxy)diphthalic anhydride (BPADA). Nanocomposites of polyimides were prepared using aromatic amine functionalized silica as a filler by solution casting method. The current work investigates the effects of incorporating long/bulky aromatic side chains and flexible linkages on the thermal, mech., elec. and optical properties of the polyimides and nanocomposites. The polyimides showed good thermal stability (T_10% = 364 & 388), high flame resistance, low glass transition temperatures (T_g = 130°C & 156°C), very low dielec. constants (2.5 & 2.8 at 1 MHz) and good optical transparency. The neat polyimides displayed good elongation at break but possessed low tensile strength. The chem. imidized polyimides showed good solubility in low and high boiling solvents. Nanocomposites of polyimides based on aromatic amine functionalized silica exhibited enhanced properties with T_10% values varying between 409-482°C, T_g between 165-280°C and higher dielec. constants (3-5.7 at 1 MHz). And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Reference of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Wang, David H.;Tan, Loon-Seng published 《Origami-Inspired Fabrication: Self-Folding or Self-Unfolding of Cross-Linked-Polyimide Objects in Extremely Hot Ambience》 in 2019. The article was appeared in 《ACS Macro Letters》. They have made some progress in their research.Recommanded Product: 38103-06-9 The article mentions the following:

A methodol. that integrates a folding step into the conventional poly(amic acid)/polyimide film fabrication scheme is developed. It enables fabricating crosslinked polyimide (XCP2) films into a host of complex-shaped objects. Particularly unprecedented is that these origami (3D) objects can be unfolded into a 2D temporary shape under externally applied stress at T ∼ T_g and remain in the free-standing, 2D configuration at room temperature until spontaneously returning to the original 3D configuration at T > 200 °C. This 3D/2D/3D cycle can be repeated >20× without showing any sign of fatigue, as exemplified by a cubic box that shows visually no dimensional change after each cycle, and even after having been immersed in a 215 °C oil bath for 3 days. The enabling materials are two series XCP2s that are crosslinked by either a phosphine oxide-containing triamine (POTAm) or a trianhydride (POTAn). These crosslinked polyimides form tough and creasable films that possess ∼100% shape memory recovery and 99% shape memory fixity and withstand over 100 fatigue-prone, strain-stress-temperature cycles, while the linear version LCP2 film exhibits much lower shape memory recovery and fails after only 7 cycles. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Computed Properties of C31H20O8《Dual-curing propargyl-phthalonitrile imide-based thermoset: Synthesis, characterization and curing behavior》 was published in 2021. The authors were Kolesnikov, Timofey I.;Orlova, Alexandra M.;Tsegelskaya, Anna Y.;Cherkaev, Georgij V.;Kechekyan, Alexander S.;Buzin, Alexander I.;Dmitryakov, Petr V.;Belousov, Sergey I.;Abramov, Igor G.;Serushkina, Olga V.;Kuznetsov, Alexander A., and the article was included in《European Polymer Journal》. The author mentioned the following in the article:

Oligoimide containing propargyl and phthalonitrile groups in one mol. (OI-PR-PN) was synthesized by a facile and eco-friendly method in benzoic acid melt. To incorporate side propargyl groups into the polyimide backbone, a new monomer was developed – 5-(2-propyn-1-yloxy) benzene-1,3-diamine (PBD). The OI-PR-PN dual-curing behavior was studied by DSC and FT-IR methods. The curing of phthalonitrile groups can be promoted by the intermediates formed during the propargyl groups polymerization This allows crosslinking of phthalonitrile groups at 300-350°C in one component system. OI-PR-PN showed good solubility in low b.p. solvents and had low melt viscosity (up to 8 Pas at 250°C). The temperatures of 10% weight loss of the cross-linked OI-PR-PN and oligoimide containing only propargyl groups (OI-PR) are 496°C and 450°C correspondingly. The completely cured OI-PR-PN glass transition temperature measured by dynamic mech. anal. was 424°C with a storage modulus 4.2 GPa at 50°C. The possibility of crosslinking without using curing additives with a combination of excellent thermal and mech. properties indicates the potential of OI-PR-PN as a matrix for composite manufacturing To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Computed Properties of C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Tundidor-Camba, Alain;Tagle, Luis H.;Terraza, Claudio A.;Rivera, Jorge;Coll, Deysma;Ortiz, Pablo A. published 《Tri-functional oligomeric polyesters prepared from new dicarboxylic acids containing several amino acids residues by Higashi methodology: synthesis, characterization, and study of solubility and thermal behavior》 in 2021. The article was appeared in 《Polymer Bulletin (Heidelberg, Germany)》. They have made some progress in their research.COA of Formula: C31H20O8 The article mentions the following:

Abstract: The synthesis of polyfunctional aliphatic oligomeric polyesters (poly(ether-imido-esters); PEIEs) containing several amino acid residues is described, and their thermal properties and solubility behavior were studied. The new sym. monomeric dicarboxylic acids were synthesized using 4-nitrophthalonitrile as starting material, which reacted with bisphenol-A or bis(4-hydroxyphenyl)diphenylmethane. Then, the tetranitrile derivatives were hydrolyzed to the tetracarboxylic acids and dehydrated to the resp. dianhydrides. Finally, these compounds reacted with the amino acids glycine or L-alanine to obtain the aliphatic dicarboxylic acid monomers. PEIEs were obtained by Higashi methodol. from these monomers and bisphenol-A, characterized by elemental anal., NMR and IR, and the results were in agreement with the structures. The materials were soluble at 25°C in several aprotic polar organic solvents and some in CHCl₃ and THF. In agreement with the viscosity and SEC results, PEIEs were oligomers with d.p. of four and six, and Mw and Mn between 7370-9790 g/mol and 3680-4850 g/mol, resp. The samples showed low T_g values (124-160°C), associated with important structural flexibility promotes by dicarboxylic acid monomers. Despite this, this parameter depended of the aminoacidic residue nature in the sense that when the volume of it increased, the T_g also increased due to a decrease in the free rotation that neg. affects the segmental movements of the chains. This effect was also observed when the side groups of the diphenol moiety of the dicarboxylic acid monomers increase from Me to Ph. The recorded TDT_10% values from the TGA anal. (334-457°C) do not allow to consider these samples as thermoset materials. In this sense, it was possible to observe an average increase of 8-13°C and 23-28°C when the lateral group volume of the amino acid residues and of the diphenol moiety are increased, resp. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.COA of Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Constantin, Catalin-Paul;Gradinaru, Luiza Madalina;Plopa, Olga;Rusu, Radu-Dan published 《Surface modification of polyimide films towards very low contact angles》. The research results were published in《Polymer Degradation and Stability》 in 2022.HPLC of Formula: 38103-06-9 The article conveys some information:

Homogeneous plasma treatment was used as a viable approach to modulate the surface characteristics of two polyimide films obtained by high-temperature polycondenzation and conventional casting. Physicochem. transformations of the polymeric materials surface were addressed through an interconnected parallel between bulk features, surface chem., topog., and wettability before and after exposure to plasma. Rigorous FTIR investigations, further complemented by EDX anal., were used to qual. assess mechanistic insights and plasma-triggered surface chem. modifications by monitoring the main changes in the position and integrated surface area of principal absorption bands. The film-forming conduct and surface specifics of pristine and modified materials were evaluated in terms of mech. stability, flexibility, morphol., optical transmittance, and roughness fluctuations. The connection between the plasma-induced hydrophilization of the two films and severe changes in polar:dispersive surface components, work of adhesion, and surface energy were thoroughly analyzed. Short- and long-term cell proliferation studies of the pristine and activated films were employed to determine the effect of plasma-induced modifications upon fibroblast growth. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.HPLC of Formula: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Jiang, Hongyu;Zhang, Hong;Wen, Yaqing;Tan, Liyun;Fang, Xingzhong;Chen, Guofei published 《Synthesis and comparative study on copolyetherimides from mixed isopropylidenebis(1,4-phenylene-oxy) bis(phthalic anhydride)s》 in 2022. The article was appeared in 《Polymer》. They have made some progress in their research.Computed Properties of C31H20O8 The article mentions the following:

Mixed isopropylidenebis(1,4-phenylene-oxy) bis(phthalic anhydride)s with different ratios (Mixed-BPADA 1-3) were synthesized successfully via aromatic nucleophilic substitution from nitrophthalonitrile and bisphenol A. The corresponding copolyetherimides (CoPEIs) were prepared with two representative aromatic diamines (4,4′-oxydianiline (4,4′-ODA) and m-phenylenediamine (m-PDA)) via two-step procedure and chem. imidization. CoPEIs showed T_gs from 222 to 256°C and T_d5%s from 486 to 505°C in argon, good mech. properties (tensile moduli of 2.5-2.9 GPa, tensile strengths of 69-96 MPa, and elongations at break of 3.3-6.3%), and good solubility With the introduction of 3-substituted phthalimide unit, CoPEIs displayed higher T_g values, lower elongations, better solubility and larger d-spacings. The rheol. properties of thermoplastic polyimide resins based on the mixed-BPADA were investigated. CoPEI-b series displayed good melt processibility, and the CoPEI-3b derived from mixed-BPADA 3 and m-PDA had the lowest melt viscosity among the copolymers. Compared to isomeric PEIs derived from BPADA isomers, CoPEIs displayed lower melt viscosities, indicating that the melt processibility had been greatly improved. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Computed Properties of C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem