Day: September 15, 2022

Related Products of 38103-06-9《Curing kinetics and thermal properties of imide containing phthalonitrile resin using aromatic amines》 was published in 2020. The authors were Kumar, Devendra;Choudhary, Veena, and the article was included in《Thermochimica Acta》. The author mentioned the following in the article:

Due to their outstanding properties, phthalonitrile based polymers plays an important role in high performance advanced materials evaluated depending upon their curing process and mechanism. Henceforth it is necessary to understand the curing kinetics of bisphthalonitrile monomer having imide linkage using 4, 4′-diaminodiphenylsulfone (DDS) as curing agent for further investigations. Thus, curing kinetics was investigated by recording non-isothermal differential scanning calorimetric (DSC) scans at heating rates of 5°C, 10°C, 15°C and 20°C/min. Activation energy for bisphthalonitrile/4, 4′-diaminodiphenylsulfone (DDS) system was calculated using Starink method and results give a substantial evidence that Arrhenius activation energy (E_a) are certainly dependent on the structure of monomer and curing agent. The cured FIPN/DDS, ODPA-PN/DDS systems show comparable high thermal stability and elevated glass transition temperature as compared to Bis-ADPN/DDS composition Subsequently, this composition exhibits comparative heat resistance and improved moisture resistance. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Formula: C31H20O8《Effects of ionic liquid doping on gas transport properties of thermally rearranged poly(hydroxyimide)s》 was published in 2021. The authors were Nocon-Szmajda, Klaudia;Wolinska-Grabczyk, Aleksandra;Jankowski, Andrzej;Dryzek, Jerzy;Dryzek, Ewa;Janeczek, Henryk;Grabiec, Eugenia;Musiol, Marta, and the article was included in《Separation and Purification Technology》. The author mentioned the following in the article:

In this study we present a novel and simple approach to improve the gas separation performance of the thermally rearranged membranes, which involves doping the polyimide precursors (HPI) with ionic liquid (IL), and carrying out its degradation along with the conversion process to polybenzoxazole (PBO) in order to facilitate the formation of larger and /or more numerous free volumes A series of aromatic (co)poly(hydroxyimide)s based on 6FDA and HAB/4MPD diamines in different molar ratios, as well as BPADA-HAB poly(hydroxyimide) were synthesized as the precursors to be doped with IL and thermally rearranged to PBO. The structural modifications of the precursor backbone were applied to study the impact of IL on the phys. properties, thermal conversion process, as well as gas transport properties of the doped polymers with different chain rigidities. The pure and IL doped (co)polyimides and their thermally rearranged counterparts were characterized by WAXD, DSC, TGA, tensile tests, and PALS, and examined in pure gas permeation experiments TR conversion temperature was considerably reduced by IL doping (e.g. by 126°C). This effect depended on the precursor chem. structure and the IL content. After thermal rearrangement of the IL doped HPIs, the membrane permeability to gases increased significantly compared to the un-doped analogs (e.g. 2 fold increase for O₂ permeability). The permeability increase was larger for the higher IL content and the precursor chain rigidity. This was accompanied by a relatively small loss in selectivity leading to the performance shift toward the 2008 upper bound. The differences in permeability among the samples correlated with the free volume size from PALS. In particular, a very good correlation was obtained (r² = 0.958), when the data fitted to the Cohen-Turnbull model concerned only PBO samples with low cohesive energy d. Further studies on HPIs doped with IL with lower degradation temperatures are suggested to mitigate polymer degradation and explore this new method for the design of improved gas separation membrane materials. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Category: benzofurans《Dual-method molding of 4D shape memory polyimide ink》 was published in 2020. The authors were Li, Xiao;Yang, Yangyang;Zhang, Yaoming;Wang, Tingmei;Yang, Zenghui;Wang, Qihua;Zhang, Xinrui, and the article was included in《Materials & Design》. The author mentioned the following in the article:

Thermoset shape memory polyimides (TPIs) are widely used in the fields of high-temperature smart devices. However, the recent molding of polyimides limits most of potentials in the form of two-dimensional film. In this work, we synthesized a novel shape memory polyimide (SMPI) ink that could be used for both digital light process and extrusion molding 3D printing. Through UV-induced free radical polymerization, 3D custom polyimides ink can be cured rapidly. Remarkably, the 3D printed PI exhibits excellent shape memory performance, with R_f of 99.8%, R_r of 98.3%, therefore the 4D printing PI was successfully prepared The 3D printed airplane, ultrasonic motor and pagoda can actively recover the film folding, expanding combined compressing, and vertical distorting to their permanent shape, which presents the outstanding 4D printing properties. Moreover, SMPI can be used in extrusion molding to print films, the residual stress induced the self-folding and then a vector model was applied to characterize transformation of extruded plates. In order to develop the application diversity of extruded 4D polyimide, self-folding box and stimuli-response gripper are designed, the gripper is able to pull up steel ball 15 times heavier than itself. Thus, SMPI will be benefit to expand the applied scope of SMPI. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)In 2019, Yang, Zenghui;Duan, Chunjian;Sun, Yong;Wang, Tingmei;Zhang, Xinrui;Wang, Qihua published 《Utilizing Polyhexahydrotriazine (PHT) to Cross-Link Polyimide Oligomers for High-Temperature Shape Memory Polymer》. 《Industrial & Engineering Chemistry Research》published the findings. The article contains the following contents:

Integrating good strength and toughness, high thermostability, and easy processability into one shape memory polymers is highly desirable yet challenging. Herein, we demonstrate an approach to fabricate high temperature shape memory polymer based on polyhexahydrotriazines (PHT) crosslinked polyimide oligomers. The obtained thermosets with enhanced thermal and mech. properties can comparable to well-established high mol. weight polyimide. The thermoset with mol. weight of polyimide oligomer as low as 8 kg/mol (PI_8k-PHT) exhibit the tensile strength, fracture toughness, and elastic modulus of 90 MPa, 69 MJ/m³, and 2059 MPa, resp. The PI_8k-PHT show good shape memory effect at 210 °C with shape fixity above 98% and shape recovery above 90%, and their temporary shapes quickly recover to original within 4 s under thermal stimulus. Besides, utilizing the partially cured prepregs sheets and further compression molding methods, the block or surface micropatterned shape memory composites can be facilely obtained. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kuo, Chih-Cheng;Lin, Yan-Cheng;Chen, Yu-Che;Wu, Ping-Han;Ando, Shinji;Ueda, Mitsuru;Chen, Wen-Chang published 《Correlating the Molecular Structure of Polyimides with threc benz, a nh2e Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz》. The research results were published in《ACS Applied Polymer Materials》 in 2021.Application of 38103-06-9 The article conveys some information:

The relationships between the structure and the dielec. properties of polyimides (PIs) were extensively studied to construct universal correlations of dielec. constant (D_k) and dissipation factor (D_f) on the structural parameters. In this study, 36 kinds of PIs with a plethora of functional groups including ether, fluorine, amide, ester, ketone, sulfide, sulfone, and alkane groups were prepared by polyaddition and thermal imidization. Accordingly, their thermal, mech., and dielec. properties were systematically investigated. The exptl. results showed highly correlated relationships between the D_k values and two structural parameters of fluorine content (F%) and volume polarizability (P/V) with a correlation coefficient of 0.98 and 0.90, resp. Likewise, the D_f value was highly correlated to the imide group content (Imide%) with a correlation coefficient of 0.95. However, a multiple pos. trend was found in the relationship between the D_f values and the volume dipole moment (μ/V) for the PIs. The discrepancy might be resulted from the difficulty to elucidate local mol. motions in the unit structure of PIs. Nevertheless, the D_f values still presented a nontrivial relation to the orientational polarization and dipole moment of the unit structures. Collectively, our exptl. results revealed the structure-dielec. properties relationships of the PIs by rational definition on a series of structural parameters and warrant further investigation. Meanwhile, this work provides systematic guidelines for mol. structure design of PIs which are promising for high frequency applications on the fifth-generation (5G) mobile communications technol.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Product Details of 38103-06-9《Polyarylene polyimides with hydrocarbon and semi-fluorinated backbones: synthesis, characterization, and properties》 was published in 2020. The authors were Budy, Stephen M.;Hall, Jamie Dore;Son, David Y., and the article was included in《Polymer Chemistry》. The author mentioned the following in the article:

A series of six new polyarylene polyimides (PAPI) was prepared from a highly phenylated phenylenediamine synthesized via a Diels-Alder reaction. The diamine was reacted with a variety of dianhydrides using a one-step microwave-assisted step-growth polycondensation reaction to give the PAPI. The polymerizations were complete in 10 to 30 min using isoquinoline as catalyst. Yields as high as 99% were achieved using nitrobenzene as the solvent. A semi-fluorinated dianhydride was included to compare polyimide properties to the hydrocarbon materials. Full characterization was carried out via¹H and ¹⁹F NMR spectroscopy and attenuated total reflectance Fourier transform IR spectroscopy. Thermal properties were characterized via thermal gravimetric anal. and differential scanning calorimetry. The onset of thermal degradation was approx. 550°C in nitrogen and air atmospheres while the char yields at 1000°C in nitrogen were almost 70%. The semi-fluorinated polyarylene polyimide exhibited the highest char yield. Glass transition temperatures were in the range of 355 to 387°C, with the semi-fluorinated material possessing the highest T_g and the most rigid material affording the lowest T_g. Optical transparency was good in all the materials, with the semi-fluorinated material having the largest optical window in the UV-Vis region. The polymers were colorless or pale yellow solids. Solubility was excellent in chloroform, THF, toluene, and cyclohexanone. We are currently interested in these materials and precursors for fuel cell and gas separation membranes, coatings, fibers, adhesives, and composite applications. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Product Details of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Nocon-Szmajda, Klaudia;Wolinska-Grabczyk, Aleksandra;Jankowski, Andrzej;Szeluga, Urszula;Wojtowicz, Magdalena;Konieczkowska, Jolanta;Hercog, Anna published 《Gas transport properties of mixed matrix membranes based on thermally rearranged poly(hydroxyimide)s filled with inorganic porous particles》 in 2020. The article was appeared in 《Separation and Purification Technology》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

In this study, we explore the use of two kinds of inorganic sieves, microporous MFI zeolite and mesoporous MCM-41 silica, as fillers to enhance the gas transport characteristics of thermally rearranged (TR) poly(hydroxyimides) (HPI). To the best of our knowledge, this is the first report on the use of these fillers to modify properties of TR HPIs, except for our previous research on MCM-41 filled HPIs based on BPADA dianhydride. In this work, 6FDA-HAB and BPADA-HAB varying in gas permeability and properties were selected as matrixes for preparation of mixed matrix membranes (MMM) with the aim of studying the effect of both the kind of filler and a matrix on thermal rearrangement and properties of the resultant TR-MMMs. In addition to pure gas permeability measurements, HPIs and MMMs were examined by WAXD, SEM, TGA, DMA, and tensile tests before and after thermal rearrangement. For all MMM precursors, the permeability increased in proportion to the filler loading (e.g. by 1.2-4.4 times for O₂) while selectivity remained virtually the same. The same effect of improved permeability and maintained selectivity was observed for the series of TR-MMMs; for example, TR-MMM based on 6FDA and filled with 7 wt% of MCM-41 exhibited 6.7 fold higher O₂ permeability over its filled precursor. The permeation properties of the filled membranes showed a strong dependence on both the kind of matrix and filler. The addition of MCM-41 particles to BPADA-HAB increased permeability more than the incorporation of the similar amount of MFI ones, while the contrary was true for 6FDA-HAB. The best result, comprising the position on the upper bound for He/N₂, has been achieved for 6FDA-HAB filled with 25 wt% of MFI, whereas its TR analog showed the highest 20.4 fold permeability improvement. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kolesnikov, Timofey I.;Orlova, Alexandra M.;Drozdov, Fedor V.;Buzin, Alexander I.;Cherkaev, Georgij V.;Kechekyan, Alexander S.;Dmitryakov, Petr V.;Belousov, Sergey I.;Kuznetsov, Alexander A. published 《New imide-based thermosets with propargyl ether groups for high temperature composite application》. The research results were published in《Polymer》 in 2022.Recommanded Product: 38103-06-9 The article conveys some information:

Development of new thermosetting polyimides with good processability is highly demanded. Oligomers with two imide cycles (bisimides), containing propargyl ether groups using 4-aminophenyl propargyl ether were prepared for the first time. Bisimides were synthesized without using of toxic solvents in benzoic or acetic acids. Use of acids as solvent allows to combine synthesis of bisimides with reaction of removing tert-butyloxycarbonyl group from amine in one step. Chem. structure of bisimides was confirmed using ¹H, ¹³C NMR, FT-IR and elemental anal. Pre-polymers exhibited wide temperature processing window and good solubility in low b.p. organic solvents. Thermal curing was investigated using differential scanning calorimetry (DSC) and FT-IR anal. Propargyl ether groups crosslink completely after 1 h at 300°C. Thermogravimetric anal. (TGA) indicated that the temperatures of 10% weight loss of cured polymers in nitrogen and air atm. were in the ranges of 492-499°C and 503-515°C, resp. Samples of Carbon fiber reinforced plastics (CFRP) were prepared using bisimides with propargyl ether groups and investigated by dynamic mech. anal. (DMA) and SEM (SEM). CFRP demonstrated glass transition temperature in the range of 309-370°C and homogeneous structure of cross-section sample. Therefore, new highly thermally stable thermosets with great processability, prepared by eco-friendly synthesis for using as high performance polymer matrix for CFRP were developed in our work. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Arrington, Clay B.;Hegde, Maruti;Meenakshisundaram, Viswanath;Dennis, Joseph M.;Williams, Christopher B.;Long, Timothy E. published 《Supramolecular Salts for Additive Manufacturing of Polyimides》 in 2021. The article was appeared in 《ACS Applied Materials & Interfaces》. They have made some progress in their research.Synthetic Route of C31H20O8 The article mentions the following:

Recent advances in vat photopolymerization (VP) additive manufacturing of fully aromatic polyimides employed photoreactive high-mol.-weight precursors dissolved at modest loadings (<20 wt %) in organic solvent. These earlier efforts revealed high isotropic shrinkage, approaching 52% on a linear basis while converting to the desired polyimide. To increase the polyimide precursor concentration and decrease shrinkage during VP processing of high-performance polyimides, photoreactive fully aromatic polyimide and thermoplastic polyetherimide (PEI) supramol. salt precursors now serve as versatile alternatives. Both pyromellitic dianhydride-4,4′-oxydianiline (PMDA-ODA) and 4,4′-(4,4′-isopropylidene-diphenoxy)diphthalic anhydride-meta phenylene diamine (BPADA-mPD) supramol. dicarboxylate-diammonium salts, termed polysalts, provided prerequisite rheol. performance and photoreactivity for VP. Solutions (50 wt %) of both photoactive polysalts exhibited viscosities more than two orders of magnitude lower than previously reported polyimide precursor solutions for VP. In addition, VP of 50 wt % polysalt solutions yielded high resolution, self-supporting organogel structures. During thermal postprocessing to the desired fully aromatic polyimide and PEI, photocrosslinked polysalt organogels exhibited retention of part shape in concert with linear isotropic shrinkage of only 26%, the lowest reported value using organogel strategies for VP of fully aromatic polyimides. Furthermore, the imidized structures exhibited comparable thermal and mech. properties to analogous polyimides synthesized using classical methodologies for 2D films. The combination of facile synthesis and increased precursor concentrations designates polysalt polyimide precursors as a versatile platform for additive manufacturing of well-defined 3D polyimide structures. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Synthetic Route of C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Ma, Kai;Chen, Guofei;Zhang, Yonggang published 《Thermal cross-link between 2,5-furandicarboxylic acid-based polyimides and bismaleimide via Diels-Alder reaction》 in 2020. The article was appeared in 《Journal of Polymer Science (Hoboken, NJ, United States)》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

A series of cross-linked polyimides (PIs) were prepared via two-step solution polycondensation from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 2,5-furandicarboxylic acid-based diamines, N,N’-bis(4-amino-2-(trifluoromethyl)phenyl)furan-2,5-dicarboxamide (TFFDA) and N,N’-bis(4-aminophenyl)furan-2,5-dicarboxamide (p-FDDA), followed by thermal crosslinking reaction with bismaleimide. The thermal crosslinking reaction and its mechanism were studied by FTIR spectra and model reaction anal., which showed Diels-Alder reaction between furan group and maleimide group played a main role in the thermal treatment. The properties of cross-linked PIs were characterized using dynamic mech. thermal anal., thermogravimetric analyses, tensile testing, UV-visible spectra, and wide-angle X-ray diffraction. The cross-linked polyimide film showed improved solvent-resistance, thermal and mech. properties with Tg values of 234-306°C, tensile strengths of 82-98 MPa and moduli of 2.3-3.0 GPa. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem