Kuo, Chih-Cheng;Lin, Yan-Cheng;Chen, Yu-Che;Wu, Ping-Han;Ando, Shinji;Ueda, Mitsuru;Chen, Wen-Chang published 《Correlating the Molecular Structure of Polyimides with threc benz, a nh2e Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz》. The research results were published in《ACS Applied Polymer Materials》 in 2021.Application of 38103-06-9 The article conveys some information:
The relationships between the structure and the dielec. properties of polyimides (PIs) were extensively studied to construct universal correlations of dielec. constant (Dk) and dissipation factor (Df) on the structural parameters. In this study, 36 kinds of PIs with a plethora of functional groups including ether, fluorine, amide, ester, ketone, sulfide, sulfone, and alkane groups were prepared by polyaddition and thermal imidization. Accordingly, their thermal, mech., and dielec. properties were systematically investigated. The exptl. results showed highly correlated relationships between the Dk values and two structural parameters of fluorine content (F%) and volume polarizability (P/V) with a correlation coefficient of 0.98 and 0.90, resp. Likewise, the Df value was highly correlated to the imide group content (Imide%) with a correlation coefficient of 0.95. However, a multiple pos. trend was found in the relationship between the Df values and the volume dipole moment (μ/V) for the PIs. The discrepancy might be resulted from the difficulty to elucidate local mol. motions in the unit structure of PIs. Nevertheless, the Df values still presented a nontrivial relation to the orientational polarization and dipole moment of the unit structures. Collectively, our exptl. results revealed the structure-dielec. properties relationships of the PIs by rational definition on a series of structural parameters and warrant further investigation. Meanwhile, this work provides systematic guidelines for mol. structure design of PIs which are promising for high frequency applications on the fifth-generation (5G) mobile communications technol.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.
5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem