Tag: 500-600

Recommanded Product: 38103-06-9《Synthesis, Properties, and Application of Homopolyimides Based on 3,5-Diaminobenzoic Acid》 was published in 2021. The authors were Chuchalov, A. V.;Bayminov, B. A.;Bilichenko, Y. V.;Kosolapov, A. F.;Semjonov, S. L.;Kononova, E. G.;Buzin, M. I.;Chaika, E. M.;Afanasyev, E. S.;Sapozhnikov, D. A.;Vygodskii, Y. S., and the article was included in《Doklady Chemistry》. The author mentioned the following in the article:

Carboxyl-containing homo polyimides based on 3,5-diaminobenzoic acid and different tetracarboxylic acid dianhydrides were synthesized by one-step high-temperature polycondensation in N-methyl-2-pyrrolidone. The effect of the dianhydride structure on the properties of the obtained polymers has been studied and the possibility of their use in situ to manufacture highly thermostable primary coatings for quartz waveguides has been shown. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

COA of Formula: C31H20O8In 2021, Okamoto, Shusuke;Sudo, Atsushi;Endo, Takeshi published 《Molecular design and synthesis of crosslinked polyimides using radical isomerization of vinylcyclopropane with thiols》. 《Journal of Applied Polymer Science》published the findings. The article contains the following contents:

Reactive polyimides bearing a vinylcyclopropane (VCP) moiety in the main chain were successfully synthesized from the corresponding diamine with the VCP moiety. Their radical crosslinking using a dithiol proceeded with the radical ring-opening reaction (RROR) of the VCP moiety to afford the corresponding crosslinked polyimides with the C=C bonds in crosslinking moieties. Thermal properties of those crosslinked polyimides were evaluated by thermal gravimetry and differential scanning calorimetry. As a result, the increase of the crosslinking degree in the crosslinked polymer exhibited great residual weight at 600°C. In contrast, the tendency of the glass transition temperature was inverse because the increase in the amount of dithiol unit as a crosslinker would enhance the mitigation of the polymer packing structure and activates the mobility of polymer chains. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.COA of Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Ma, Kai;Chen, Guofei;Zhang, Yonggang published 《Thermal cross-link between 2,5-furandicarboxylic acid-based polyimides and bismaleimide via Diels-Alder reaction》 in 2020. The article was appeared in 《Journal of Polymer Science (Hoboken, NJ, United States)》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

A series of cross-linked polyimides (PIs) were prepared via two-step solution polycondensation from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 2,5-furandicarboxylic acid-based diamines, N,N’-bis(4-amino-2-(trifluoromethyl)phenyl)furan-2,5-dicarboxamide (TFFDA) and N,N’-bis(4-aminophenyl)furan-2,5-dicarboxamide (p-FDDA), followed by thermal crosslinking reaction with bismaleimide. The thermal crosslinking reaction and its mechanism were studied by FTIR spectra and model reaction anal., which showed Diels-Alder reaction between furan group and maleimide group played a main role in the thermal treatment. The properties of cross-linked PIs were characterized using dynamic mech. thermal anal., thermogravimetric analyses, tensile testing, UV-visible spectra, and wide-angle X-ray diffraction. The cross-linked polyimide film showed improved solvent-resistance, thermal and mech. properties with Tg values of 234-306°C, tensile strengths of 82-98 MPa and moduli of 2.3-3.0 GPa. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Arrington, Clay B.;Hegde, Maruti;Meenakshisundaram, Viswanath;Dennis, Joseph M.;Williams, Christopher B.;Long, Timothy E. published 《Supramolecular Salts for Additive Manufacturing of Polyimides》 in 2021. The article was appeared in 《ACS Applied Materials & Interfaces》. They have made some progress in their research.Synthetic Route of C31H20O8 The article mentions the following:

Recent advances in vat photopolymerization (VP) additive manufacturing of fully aromatic polyimides employed photoreactive high-mol.-weight precursors dissolved at modest loadings (<20 wt %) in organic solvent. These earlier efforts revealed high isotropic shrinkage, approaching 52% on a linear basis while converting to the desired polyimide. To increase the polyimide precursor concentration and decrease shrinkage during VP processing of high-performance polyimides, photoreactive fully aromatic polyimide and thermoplastic polyetherimide (PEI) supramol. salt precursors now serve as versatile alternatives. Both pyromellitic dianhydride-4,4′-oxydianiline (PMDA-ODA) and 4,4′-(4,4′-isopropylidene-diphenoxy)diphthalic anhydride-meta phenylene diamine (BPADA-mPD) supramol. dicarboxylate-diammonium salts, termed polysalts, provided prerequisite rheol. performance and photoreactivity for VP. Solutions (50 wt %) of both photoactive polysalts exhibited viscosities more than two orders of magnitude lower than previously reported polyimide precursor solutions for VP. In addition, VP of 50 wt % polysalt solutions yielded high resolution, self-supporting organogel structures. During thermal postprocessing to the desired fully aromatic polyimide and PEI, photocrosslinked polysalt organogels exhibited retention of part shape in concert with linear isotropic shrinkage of only 26%, the lowest reported value using organogel strategies for VP of fully aromatic polyimides. Furthermore, the imidized structures exhibited comparable thermal and mech. properties to analogous polyimides synthesized using classical methodologies for 2D films. The combination of facile synthesis and increased precursor concentrations designates polysalt polyimide precursors as a versatile platform for additive manufacturing of well-defined 3D polyimide structures. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Synthetic Route of C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kolesnikov, Timofey I.;Orlova, Alexandra M.;Drozdov, Fedor V.;Buzin, Alexander I.;Cherkaev, Georgij V.;Kechekyan, Alexander S.;Dmitryakov, Petr V.;Belousov, Sergey I.;Kuznetsov, Alexander A. published 《New imide-based thermosets with propargyl ether groups for high temperature composite application》. The research results were published in《Polymer》 in 2022.Recommanded Product: 38103-06-9 The article conveys some information:

Development of new thermosetting polyimides with good processability is highly demanded. Oligomers with two imide cycles (bisimides), containing propargyl ether groups using 4-aminophenyl propargyl ether were prepared for the first time. Bisimides were synthesized without using of toxic solvents in benzoic or acetic acids. Use of acids as solvent allows to combine synthesis of bisimides with reaction of removing tert-butyloxycarbonyl group from amine in one step. Chem. structure of bisimides was confirmed using ¹H, ¹³C NMR, FT-IR and elemental anal. Pre-polymers exhibited wide temperature processing window and good solubility in low b.p. organic solvents. Thermal curing was investigated using differential scanning calorimetry (DSC) and FT-IR anal. Propargyl ether groups crosslink completely after 1 h at 300°C. Thermogravimetric anal. (TGA) indicated that the temperatures of 10% weight loss of cured polymers in nitrogen and air atm. were in the ranges of 492-499°C and 503-515°C, resp. Samples of Carbon fiber reinforced plastics (CFRP) were prepared using bisimides with propargyl ether groups and investigated by dynamic mech. anal. (DMA) and SEM (SEM). CFRP demonstrated glass transition temperature in the range of 309-370°C and homogeneous structure of cross-section sample. Therefore, new highly thermally stable thermosets with great processability, prepared by eco-friendly synthesis for using as high performance polymer matrix for CFRP were developed in our work. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Nocon-Szmajda, Klaudia;Wolinska-Grabczyk, Aleksandra;Jankowski, Andrzej;Szeluga, Urszula;Wojtowicz, Magdalena;Konieczkowska, Jolanta;Hercog, Anna published 《Gas transport properties of mixed matrix membranes based on thermally rearranged poly(hydroxyimide)s filled with inorganic porous particles》 in 2020. The article was appeared in 《Separation and Purification Technology》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

In this study, we explore the use of two kinds of inorganic sieves, microporous MFI zeolite and mesoporous MCM-41 silica, as fillers to enhance the gas transport characteristics of thermally rearranged (TR) poly(hydroxyimides) (HPI). To the best of our knowledge, this is the first report on the use of these fillers to modify properties of TR HPIs, except for our previous research on MCM-41 filled HPIs based on BPADA dianhydride. In this work, 6FDA-HAB and BPADA-HAB varying in gas permeability and properties were selected as matrixes for preparation of mixed matrix membranes (MMM) with the aim of studying the effect of both the kind of filler and a matrix on thermal rearrangement and properties of the resultant TR-MMMs. In addition to pure gas permeability measurements, HPIs and MMMs were examined by WAXD, SEM, TGA, DMA, and tensile tests before and after thermal rearrangement. For all MMM precursors, the permeability increased in proportion to the filler loading (e.g. by 1.2-4.4 times for O₂) while selectivity remained virtually the same. The same effect of improved permeability and maintained selectivity was observed for the series of TR-MMMs; for example, TR-MMM based on 6FDA and filled with 7 wt% of MCM-41 exhibited 6.7 fold higher O₂ permeability over its filled precursor. The permeation properties of the filled membranes showed a strong dependence on both the kind of matrix and filler. The addition of MCM-41 particles to BPADA-HAB increased permeability more than the incorporation of the similar amount of MFI ones, while the contrary was true for 6FDA-HAB. The best result, comprising the position on the upper bound for He/N₂, has been achieved for 6FDA-HAB filled with 25 wt% of MFI, whereas its TR analog showed the highest 20.4 fold permeability improvement. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Product Details of 38103-06-9《Polyarylene polyimides with hydrocarbon and semi-fluorinated backbones: synthesis, characterization, and properties》 was published in 2020. The authors were Budy, Stephen M.;Hall, Jamie Dore;Son, David Y., and the article was included in《Polymer Chemistry》. The author mentioned the following in the article:

A series of six new polyarylene polyimides (PAPI) was prepared from a highly phenylated phenylenediamine synthesized via a Diels-Alder reaction. The diamine was reacted with a variety of dianhydrides using a one-step microwave-assisted step-growth polycondensation reaction to give the PAPI. The polymerizations were complete in 10 to 30 min using isoquinoline as catalyst. Yields as high as 99% were achieved using nitrobenzene as the solvent. A semi-fluorinated dianhydride was included to compare polyimide properties to the hydrocarbon materials. Full characterization was carried out via¹H and ¹⁹F NMR spectroscopy and attenuated total reflectance Fourier transform IR spectroscopy. Thermal properties were characterized via thermal gravimetric anal. and differential scanning calorimetry. The onset of thermal degradation was approx. 550°C in nitrogen and air atmospheres while the char yields at 1000°C in nitrogen were almost 70%. The semi-fluorinated polyarylene polyimide exhibited the highest char yield. Glass transition temperatures were in the range of 355 to 387°C, with the semi-fluorinated material possessing the highest T_g and the most rigid material affording the lowest T_g. Optical transparency was good in all the materials, with the semi-fluorinated material having the largest optical window in the UV-Vis region. The polymers were colorless or pale yellow solids. Solubility was excellent in chloroform, THF, toluene, and cyclohexanone. We are currently interested in these materials and precursors for fuel cell and gas separation membranes, coatings, fibers, adhesives, and composite applications. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Product Details of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kuo, Chih-Cheng;Lin, Yan-Cheng;Chen, Yu-Che;Wu, Ping-Han;Ando, Shinji;Ueda, Mitsuru;Chen, Wen-Chang published 《Correlating the Molecular Structure of Polyimides with threc benz, a nh2e Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz》. The research results were published in《ACS Applied Polymer Materials》 in 2021.Application of 38103-06-9 The article conveys some information:

The relationships between the structure and the dielec. properties of polyimides (PIs) were extensively studied to construct universal correlations of dielec. constant (D_k) and dissipation factor (D_f) on the structural parameters. In this study, 36 kinds of PIs with a plethora of functional groups including ether, fluorine, amide, ester, ketone, sulfide, sulfone, and alkane groups were prepared by polyaddition and thermal imidization. Accordingly, their thermal, mech., and dielec. properties were systematically investigated. The exptl. results showed highly correlated relationships between the D_k values and two structural parameters of fluorine content (F%) and volume polarizability (P/V) with a correlation coefficient of 0.98 and 0.90, resp. Likewise, the D_f value was highly correlated to the imide group content (Imide%) with a correlation coefficient of 0.95. However, a multiple pos. trend was found in the relationship between the D_f values and the volume dipole moment (μ/V) for the PIs. The discrepancy might be resulted from the difficulty to elucidate local mol. motions in the unit structure of PIs. Nevertheless, the D_f values still presented a nontrivial relation to the orientational polarization and dipole moment of the unit structures. Collectively, our exptl. results revealed the structure-dielec. properties relationships of the PIs by rational definition on a series of structural parameters and warrant further investigation. Meanwhile, this work provides systematic guidelines for mol. structure design of PIs which are promising for high frequency applications on the fifth-generation (5G) mobile communications technol.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)In 2019, Yang, Zenghui;Duan, Chunjian;Sun, Yong;Wang, Tingmei;Zhang, Xinrui;Wang, Qihua published 《Utilizing Polyhexahydrotriazine (PHT) to Cross-Link Polyimide Oligomers for High-Temperature Shape Memory Polymer》. 《Industrial & Engineering Chemistry Research》published the findings. The article contains the following contents:

Integrating good strength and toughness, high thermostability, and easy processability into one shape memory polymers is highly desirable yet challenging. Herein, we demonstrate an approach to fabricate high temperature shape memory polymer based on polyhexahydrotriazines (PHT) crosslinked polyimide oligomers. The obtained thermosets with enhanced thermal and mech. properties can comparable to well-established high mol. weight polyimide. The thermoset with mol. weight of polyimide oligomer as low as 8 kg/mol (PI_8k-PHT) exhibit the tensile strength, fracture toughness, and elastic modulus of 90 MPa, 69 MJ/m³, and 2059 MPa, resp. The PI_8k-PHT show good shape memory effect at 210 °C with shape fixity above 98% and shape recovery above 90%, and their temporary shapes quickly recover to original within 4 s under thermal stimulus. Besides, utilizing the partially cured prepregs sheets and further compression molding methods, the block or surface micropatterned shape memory composites can be facilely obtained. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Quality Control of 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Category: benzofurans《Dual-method molding of 4D shape memory polyimide ink》 was published in 2020. The authors were Li, Xiao;Yang, Yangyang;Zhang, Yaoming;Wang, Tingmei;Yang, Zenghui;Wang, Qihua;Zhang, Xinrui, and the article was included in《Materials & Design》. The author mentioned the following in the article:

Thermoset shape memory polyimides (TPIs) are widely used in the fields of high-temperature smart devices. However, the recent molding of polyimides limits most of potentials in the form of two-dimensional film. In this work, we synthesized a novel shape memory polyimide (SMPI) ink that could be used for both digital light process and extrusion molding 3D printing. Through UV-induced free radical polymerization, 3D custom polyimides ink can be cured rapidly. Remarkably, the 3D printed PI exhibits excellent shape memory performance, with R_f of 99.8%, R_r of 98.3%, therefore the 4D printing PI was successfully prepared The 3D printed airplane, ultrasonic motor and pagoda can actively recover the film folding, expanding combined compressing, and vertical distorting to their permanent shape, which presents the outstanding 4D printing properties. Moreover, SMPI can be used in extrusion molding to print films, the residual stress induced the self-folding and then a vector model was applied to characterize transformation of extruded plates. In order to develop the application diversity of extruded 4D polyimide, self-folding box and stimuli-response gripper are designed, the gripper is able to pull up steel ball 15 times heavier than itself. Thus, SMPI will be benefit to expand the applied scope of SMPI. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Category: benzofurans It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem