High Performance Polymers | Cas: 38103-06-9 was involved in experiment

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Application of 38103-06-9In 2022, Ma, Kai;Jiang, Hanzhou;Chen, Guofei;Wang, Wei;Zhang, Yonggang published 《Polyimides from 2,5-bis[4-(4-aminophenoxy)benzoyl]furan and their thermal crosslinking reaction》. 《High Performance Polymers》published the findings. The article contains the following contents:

Several polyimides were prepared via two-step polycondensation from novel 2,5-furandicarboxylic acid-based diamine, 2,5-bis[4-(4-aminophenoxy)benzoyl]furan, with com. dianhydrides. The chem. structures of the monomers and polymers were characterized by FT-IR and NMR in detail, resp. The polyimides exhibited high performances with 5 wt% weight loss temperatures of over 410°C, glass transition temperatures of over 214°C, and tensile strengths and Young’s moduli of up to 130 MPa and 3.2 GPa, resp. The thermal crosslinking mechanism was studied by FT-IR, Raman spectroscopy, and model reaction anal., which showed the Diels-Alder reaction between the furan group and diphenylethylene group was the main reaction. The crosslinked polyimide films showed improved solvent resistance, and thermal and mech. properties.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem