Category: benzofurans

Huang, Xinzuo;Zhang, Fenghua;Liu, Yanju;Leng, Jinsong published 《Active and Deformable Organic Electronic Devices based on Conductive Shape Memory Polyimide》 in 2020. The article was appeared in 《ACS Applied Materials & Interfaces》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

Smart, deformable, and transparent electrodes are a significant part of flexible optoelectronic devices. In this work, a novel approach to making highly transparent, smooth, and conductive shape memory polyimide hybrids has been proposed. Colorless shape memory polyimide (CSMPI) with high optical transparency and high heat resistance is served as the substrate for flexible electronic devices for the first time. A hybrid (Au/Ag) metal grid electrode embedded in CSMPI (BMG/CSMPI) is first fabricated via self-cracking template and solution-coating, the advantages of which include ultrasmooth surface, superior mech. flexibility and durability, strong surface adhesion, and excellent chem. stability due to the unique embedded hybrid structure. The resulting white polymer light emitting diodes (WPLEDs) based on BMG/CSMPI with shape memory effect are active and deformable, and are converted from 2D device into 3D devices depending on its variable stiffness characteristics. The deformed 3D devices could actively recover to the original shape upon heating. Furthermore, ultrathin and flexible 3D optoelectronic devices fabricated using shape memory polymers can promote the development of advanced optoelectronic applications in the future. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Application of 38103-06-9《Effects of Diamines on the Optical Properties of Poly(ether imide)s Derived from 2,2-Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane Dianhydride (BPADA)》 was published in 2019. The authors were Li, Linshuang;Xu, Yong;Che, Jianfei;Liu, Xiaohong;Zhao, Wei;Ye, Zhifeng, and the article was included in《Macromolecular Research》. The author mentioned the following in the article:

The objective of this study was to investigate the effects of diamines with ether group or/and trifluoromethyl (-CF₃) group on the optical properties of polyimides. A series of poly(ether imide)s (PEIs) (III) were prepared from 2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl]propane dianhydride (BPADA) with various aromatic diamines (I_a-h) including non-fluorinated diamines (I_a-d) and the corresponding trifluoromethyl-substituted diamines (I_e-h). The fluorinated PEIs III_e-h based on fluorinated diamines were nearly colorless with cutoff absorption wavelength (λ₀) below 370 nm and with solubility higher than that of the corresponding CF₃-free analogs (III_a-d). Meanwhile, they had lower dielec. constants in the range of 2.91-3.21 at 1 MHz coupled with water absorptions below 0.70% and contact angles against water beyond 108°. The III series had tensile strength of 84.3-94.4 MPa, modulus of elasticity of 3.6-8.9 GPa and elongation at break of 9.4-25.3%, together with temperatures of 5% weight loss (T_5%) beyond 510 °C. Compared to the IV series based on 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6FDA), the corresponding III series exhibited better thermal and mech. properties coupled with good optical properties, especially the fluorinated PEIs III_e-h.5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) were involved in the experimental procedure.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Application of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

COA of Formula: C31H20O8In 2021, Li, Qing;Liu, Sheng;Guo, Yujuan;Liang, Yulin;Peng, Hualing;Chen, Ronghua;Lei, Fuhou;Wu, Wei;Zhao, Hui;Zhang, Qunchao;Li, Robert K. Y.;Duan, Wengui published 《Mussel-Inspired Polydopamine-Enhanced Polyimide for Ultrahigh Toughness and Ultraviolet Shielding Applications》. 《ACS Applied Polymer Materials》published the findings. The article contains the following contents:

A series of polyimide (PI)-based UV shielding nanocomposites were prepared with size-controlled polydopamine (PDA) nanoparticles. Two typical sizes of 120 and 200 nm were chosen to mainly investigate the influence of PDA on the structures, thermal stability, mech. performance, and UV shielding properties of PI nanocomposites. The results revealed that the PI nanocomposites containing 120 nm PDA nanoparticles showed continuously improved mech. properties with a maximum tensile strength of 94.1 MPa and a maximum elongation at break of 103.6%, resp., which were 1.33 and 7.50x those of pure PI due to the strong adsorption between the PDA and PI mols. Meanwhile, the PI nanocomposites with 200 nm PDA nanoparticles exhibited a maximum tensile strength of 78.9 MPa and an elongation at break of 83.5% when the content of PDA was 0.5 weight %. When the content of 200 nm PDA nanoparticles increased to 1 weight %, the PI nanocomposites exhibited a regressive tendency in mech. properties due to the decrease in the number of adsorption sites and the expanded distance between the PI mols. caused by the increase in the PDA size. UV-vis tests exhibited that the PI nanocomposites were transparent to visible light at low PDA loadings and maintained a superior UV shielding performance and durability, especially for PI nanocomposites with 120 nm PDA nanoparticles, which was ascribed to the absorption of UV light by the PI matrix and PDA filler. Moreover, the PI nanocomposites with smaller PDA nanoparticles had a better thermal stability. The initial degradation temperatures of the PI nanocomposites containing 120 nm PDA were above 510°C, which endow them the possibility to serve as flexible UV shielding materials in high temperatures and intense UV radiation. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.COA of Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kuznetsov, D. A.;Didenko, A. L.;Svetlichnyi, V. M.;Smirnova, V. E.;Popova, E. N.;Vaganov, G. V.;Yudin, V. E.;Kudryavtsev, V. V. published 《Effect of Hard Segment Structure on the Thermomechanical Properties of Polyurethaneimides》. The research results were published in《Polymer Science, Series A: Polymer Physics》 in 2019.Formula: C31H20O8 The article conveys some information:

New segmented polyurethaneimides containing poly(ethylene glycol adipate) soft segments and bis(urethaneimide) hard segments are synthesized. Copolymers are obtained on the basis of poly(ethylene glycol adipate) (M_n = 2.5 x 10³) terminated with 2,4-toluene diisocyanate, two aromatic dianhydrides, and six aromatic diamines. The structure of the synthesized polymers is studied by IR and NMR spectroscopy. The thermal properties of the copolymers are characterized by TGA and DSC. Effects of hard segment length and substituent position in the diamine fragment on the thermal and mech. properties of the polyurethaneimides are investigated. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Recommanded Product: 38103-06-9《Mechanically Strong, Thermally Stable, and Flame Retardant Poly(ether imide) Terminated with Phosphonium Bromide》 was published in 2019. The authors were Cao, Ke;Guo, Yichen;Zhang, Mingxuan;Arrington, Clay B.;Long, Timothy E.;Odle, Roy R.;Liu, Guoliang, and the article was included in《Macromolecules (Washington, DC, United States)》. The author mentioned the following in the article:

Phosphonium bromide-terminated poly(ether imide)s (PEI-PhPPh₃Br) possessing high mech. strength, thermal stability, and flame retardancy were synthesized by functionalizing dianhydride-terminated poly(ether imide)s (PEI-DA) with triphenyl-4-aminophenylphosphonium bromide. The PEI-PhPPh₃Br exhibited excellent tensile properties, thermal stability, and flame retardancy. The PEI-PhPPh₃Br with a mol. weight of 12 kDa [PEI-PhPPh₃Br (12k)] showed a tensile strength of 109 ± 4 MPa and a Young’s modulus of 2.75 ± 0.12 GPa, much higher than those of the noncharged PEI analog. PEI-PhPPh₃Br (12k) also showed outstanding flame retardancy, better than the state-of-the-art com. PEIs, as evidenced by the high limiting oxygen index of 51% and high char yield of 60% at 980 °C. The study herein provides a highly effective strategy to simultaneously improve mech. strength, thermal stability, and flame retardancy, which are three important properties rarely possessed by most polymers. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Recommanded Product: 38103-06-9《Synthesis, Properties, and Application of Homopolyimides Based on 3,5-Diaminobenzoic Acid》 was published in 2021. The authors were Chuchalov, A. V.;Bayminov, B. A.;Bilichenko, Y. V.;Kosolapov, A. F.;Semjonov, S. L.;Kononova, E. G.;Buzin, M. I.;Chaika, E. M.;Afanasyev, E. S.;Sapozhnikov, D. A.;Vygodskii, Y. S., and the article was included in《Doklady Chemistry》. The author mentioned the following in the article:

Carboxyl-containing homo polyimides based on 3,5-diaminobenzoic acid and different tetracarboxylic acid dianhydrides were synthesized by one-step high-temperature polycondensation in N-methyl-2-pyrrolidone. The effect of the dianhydride structure on the properties of the obtained polymers has been studied and the possibility of their use in situ to manufacture highly thermostable primary coatings for quartz waveguides has been shown. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

COA of Formula: C31H20O8In 2021, Okamoto, Shusuke;Sudo, Atsushi;Endo, Takeshi published 《Molecular design and synthesis of crosslinked polyimides using radical isomerization of vinylcyclopropane with thiols》. 《Journal of Applied Polymer Science》published the findings. The article contains the following contents:

Reactive polyimides bearing a vinylcyclopropane (VCP) moiety in the main chain were successfully synthesized from the corresponding diamine with the VCP moiety. Their radical crosslinking using a dithiol proceeded with the radical ring-opening reaction (RROR) of the VCP moiety to afford the corresponding crosslinked polyimides with the C=C bonds in crosslinking moieties. Thermal properties of those crosslinked polyimides were evaluated by thermal gravimetry and differential scanning calorimetry. As a result, the increase of the crosslinking degree in the crosslinked polymer exhibited great residual weight at 600°C. In contrast, the tendency of the glass transition temperature was inverse because the increase in the amount of dithiol unit as a crosslinker would enhance the mitigation of the polymer packing structure and activates the mobility of polymer chains. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.COA of Formula: C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Ma, Kai;Chen, Guofei;Zhang, Yonggang published 《Thermal cross-link between 2,5-furandicarboxylic acid-based polyimides and bismaleimide via Diels-Alder reaction》 in 2020. The article was appeared in 《Journal of Polymer Science (Hoboken, NJ, United States)》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:

A series of cross-linked polyimides (PIs) were prepared via two-step solution polycondensation from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 2,5-furandicarboxylic acid-based diamines, N,N’-bis(4-amino-2-(trifluoromethyl)phenyl)furan-2,5-dicarboxamide (TFFDA) and N,N’-bis(4-aminophenyl)furan-2,5-dicarboxamide (p-FDDA), followed by thermal crosslinking reaction with bismaleimide. The thermal crosslinking reaction and its mechanism were studied by FTIR spectra and model reaction anal., which showed Diels-Alder reaction between furan group and maleimide group played a main role in the thermal treatment. The properties of cross-linked PIs were characterized using dynamic mech. thermal anal., thermogravimetric analyses, tensile testing, UV-visible spectra, and wide-angle X-ray diffraction. The cross-linked polyimide film showed improved solvent-resistance, thermal and mech. properties with Tg values of 234-306°C, tensile strengths of 82-98 MPa and moduli of 2.3-3.0 GPa. To complete the study, the researchers used 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Arrington, Clay B.;Hegde, Maruti;Meenakshisundaram, Viswanath;Dennis, Joseph M.;Williams, Christopher B.;Long, Timothy E. published 《Supramolecular Salts for Additive Manufacturing of Polyimides》 in 2021. The article was appeared in 《ACS Applied Materials & Interfaces》. They have made some progress in their research.Synthetic Route of C31H20O8 The article mentions the following:

Recent advances in vat photopolymerization (VP) additive manufacturing of fully aromatic polyimides employed photoreactive high-mol.-weight precursors dissolved at modest loadings (<20 wt %) in organic solvent. These earlier efforts revealed high isotropic shrinkage, approaching 52% on a linear basis while converting to the desired polyimide. To increase the polyimide precursor concentration and decrease shrinkage during VP processing of high-performance polyimides, photoreactive fully aromatic polyimide and thermoplastic polyetherimide (PEI) supramol. salt precursors now serve as versatile alternatives. Both pyromellitic dianhydride-4,4′-oxydianiline (PMDA-ODA) and 4,4′-(4,4′-isopropylidene-diphenoxy)diphthalic anhydride-meta phenylene diamine (BPADA-mPD) supramol. dicarboxylate-diammonium salts, termed polysalts, provided prerequisite rheol. performance and photoreactivity for VP. Solutions (50 wt %) of both photoactive polysalts exhibited viscosities more than two orders of magnitude lower than previously reported polyimide precursor solutions for VP. In addition, VP of 50 wt % polysalt solutions yielded high resolution, self-supporting organogel structures. During thermal postprocessing to the desired fully aromatic polyimide and PEI, photocrosslinked polysalt organogels exhibited retention of part shape in concert with linear isotropic shrinkage of only 26%, the lowest reported value using organogel strategies for VP of fully aromatic polyimides. Furthermore, the imidized structures exhibited comparable thermal and mech. properties to analogous polyimides synthesized using classical methodologies for 2D films. The combination of facile synthesis and increased precursor concentrations designates polysalt polyimide precursors as a versatile platform for additive manufacturing of well-defined 3D polyimide structures. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Synthetic Route of C31H20O8 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem

Kolesnikov, Timofey I.;Orlova, Alexandra M.;Drozdov, Fedor V.;Buzin, Alexander I.;Cherkaev, Georgij V.;Kechekyan, Alexander S.;Dmitryakov, Petr V.;Belousov, Sergey I.;Kuznetsov, Alexander A. published 《New imide-based thermosets with propargyl ether groups for high temperature composite application》. The research results were published in《Polymer》 in 2022.Recommanded Product: 38103-06-9 The article conveys some information:

Development of new thermosetting polyimides with good processability is highly demanded. Oligomers with two imide cycles (bisimides), containing propargyl ether groups using 4-aminophenyl propargyl ether were prepared for the first time. Bisimides were synthesized without using of toxic solvents in benzoic or acetic acids. Use of acids as solvent allows to combine synthesis of bisimides with reaction of removing tert-butyloxycarbonyl group from amine in one step. Chem. structure of bisimides was confirmed using ¹H, ¹³C NMR, FT-IR and elemental anal. Pre-polymers exhibited wide temperature processing window and good solubility in low b.p. organic solvents. Thermal curing was investigated using differential scanning calorimetry (DSC) and FT-IR anal. Propargyl ether groups crosslink completely after 1 h at 300°C. Thermogravimetric anal. (TGA) indicated that the temperatures of 10% weight loss of cured polymers in nitrogen and air atm. were in the ranges of 492-499°C and 503-515°C, resp. Samples of Carbon fiber reinforced plastics (CFRP) were prepared using bisimides with propargyl ether groups and investigated by dynamic mech. anal. (DMA) and SEM (SEM). CFRP demonstrated glass transition temperature in the range of 309-370°C and homogeneous structure of cross-section sample. Therefore, new highly thermally stable thermosets with great processability, prepared by eco-friendly synthesis for using as high performance polymer matrix for CFRP were developed in our work. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.

5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Recommanded Product: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem