Huang, Xinzuo;Zhang, Fenghua;Liu, Yanju;Leng, Jinsong published 《Active and Deformable Organic Electronic Devices based on Conductive Shape Memory Polyimide》 in 2020. The article was appeared in 《ACS Applied Materials & Interfaces》. They have made some progress in their research.Related Products of 38103-06-9 The article mentions the following:
Smart, deformable, and transparent electrodes are a significant part of flexible optoelectronic devices. In this work, a novel approach to making highly transparent, smooth, and conductive shape memory polyimide hybrids has been proposed. Colorless shape memory polyimide (CSMPI) with high optical transparency and high heat resistance is served as the substrate for flexible electronic devices for the first time. A hybrid (Au/Ag) metal grid electrode embedded in CSMPI (BMG/CSMPI) is first fabricated via self-cracking template and solution-coating, the advantages of which include ultrasmooth surface, superior mech. flexibility and durability, strong surface adhesion, and excellent chem. stability due to the unique embedded hybrid structure. The resulting white polymer light emitting diodes (WPLEDs) based on BMG/CSMPI with shape memory effect are active and deformable, and are converted from 2D device into 3D devices depending on its variable stiffness characteristics. The deformed 3D devices could actively recover to the original shape upon heating. Furthermore, ultrathin and flexible 3D optoelectronic devices fabricated using shape memory polymers can promote the development of advanced optoelectronic applications in the future. And 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) was used in the research process.
5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.Related Products of 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem