Kolesnikov, T. I.;Tsegelskaya, A. Y.;Dutov, M. D.;Orlova, A. M.;Kuznetsov, A. A. published 《Synthesis and study of the properties of thermoset oligoimides with propargyl fragment》. The research results were published in《IOP Conference Series: Materials Science and Engineering》 in 2019.SDS of cas: 38103-06-9 The article conveys some information:
A series of thermoplastic oligoimides with a propargyl substituent in the side chain was synthesized by the method of high-temperature catalytic copolycondensation in the melt of benzoic acid based on the monomer 5-(2-propyn-1-yloxy) benzene-1,3-diamine (PBD), 2,2-bis-[(3,4-di-carboxyphenoxy)phenyl]propane dianhydride (BPADA), 2,2-bis-[(4-aminophenoxy)phenyl]propane (BAPP) and phthalic anhydride (PA). The uncured imide oligomers showed good solubility (>20 wt% in N-methyl-2-pyrrolidone), wide temperature processing window (>50°C) and also flow well at 220°C. These imide oligomers were successfully converted to cross-linked structures after curing at 300°C. Cross-linked oligomers have a temperature of 5% weight loss >500°C and Tg >200°C. The experimental procedure involved many compounds, such as 5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione) (cas: 38103-06-9) .
5,5′-((Propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(isobenzofuran-1,3-dione)(cas: 38103-06-9) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material.SDS of cas: 38103-06-9 It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.
Reference:
Benzofuran – Wikipedia,
Benzofuran | C8H6O – PubChem